Electrically interconnected assemblies of microscale device components by printing and molding
نویسندگان
چکیده
by printing and molding Mo Joon Kim, Jongseung Yoon, Sang-Il Park, and John A. Rogers Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 South Goodwin Avenue, Urbana, Illinois 61801, USA Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA Department of Mechanical Science and Engineering, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
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